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Resistance Measuring Instrument Product List

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Non-contact sheet resistance measurement device "LEI-1510 Series"

Excellent measurement linearity over a wide range! Can be verified on a PC monitor as a three-dimensional graphic map.

The "LEI-1510 series" is a non-contact sheet resistance measurement device manufactured by the former Reihiton company. By attaching a robot, it is possible to quickly measure and process multiple samples. It solves the reproducibility issues caused by probe contact contamination and the contact condition that occur with the four-probe method. It measures sheet resistance non-contact and destructively for Si wafers ranging from 2 inches to a maximum of 8 inches, as well as compound semiconductor (GaAs, GaN, InP, etc.) epi wafers. 【Features】 - Solves reproducibility issues caused by probe contact contamination and contact conditions - Capable of quickly measuring and processing multiple samples - Excellent measurement linearity over a wide range of 0.035 to 3200 ohm/sq. - Measurement data can be viewed as a three-dimensional graphic map on a PC monitor *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Semiconductor inspection/test equipment

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Fully Automatic Expansion Resistance Measurement Device SRP2000

Fully automatic spreading resistance measurement device

The SRP (Spreading Resistance Profiler) device measures the resistivity profile of silicon in the depth direction, the thickness of the EPI layer, the depth of the PN junction, and the carrier concentration distribution by making contact with two probes on a diagonally polished silicon wafer in the depth direction and measuring the spreading resistance value between the probes.

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Expansion Resistance Measurement Device "SRP-170/2100"

Measure the depth of PN junction and carrier concentration distribution! Surface resistance measurement available as an option!

We would like to introduce our spread resistance measurement device, the 'SRP-170/2100'. By making contact with two probes in the depth direction on a diagonally polished Si wafer, we can measure the specific resistivity profile in the depth direction of Si, the thickness of the EPI layer, the depth of the PN junction, and the carrier concentration distribution from the spread resistance value between the probes. The "SRP2000" automates the conditioning of the probes, measurement of the bevel angle, and data input for standard samples, allowing for continuous automatic measurement of multiple samples, with a maximum of 6 samples able to be loaded simultaneously. 【Features】 ■ World-standard carrier concentration distribution and profile measurement device ■ Supports measurement automation (SRP-2100) ■ Surface resistance measurement available as an option (SRP-170) *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Semiconductor inspection/test equipment
  • Other inspection equipment and devices

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